BE Semiconductor Industries (OTCMKTS:BESIY) Sees Significant Increase in Short Interest

BE Semiconductor Industries (OTCMKTS:BESIYGet Rating) saw a large growth in short interest in April. As of April 15th, there was short interest totalling 2,500 shares, a growth of 2,400.0% from the March 31st total of 100 shares. Based on an average daily trading volume, of 2,200 shares, the days-to-cover ratio is currently 1.1 days.

OTCMKTS BESIY traded down $4.35 during trading on Wednesday, reaching $68.90. 1,409 shares of the company’s stock traded hands, compared to its average volume of 4,263. The company has a debt-to-equity ratio of 0.49, a current ratio of 4.99 and a quick ratio of 4.49. The firm has a market cap of $5.00 billion, a price-to-earnings ratio of 17.18 and a beta of 1.34. The company’s 50 day simple moving average is $80.20 and its two-hundred day simple moving average is $83.80. BE Semiconductor Industries has a 12-month low of $67.55 and a 12-month high of $98.23.

BE Semiconductor Industries (OTCMKTS:BESIYGet Rating) last posted its earnings results on Friday, February 18th. The technology company reported $0.91 EPS for the quarter. The business had revenue of $196.41 million for the quarter. BE Semiconductor Industries had a net margin of 37.66% and a return on equity of 51.55%.

Separately, UBS Group reiterated a “buy” rating on shares of BE Semiconductor Industries in a report on Tuesday, February 22nd. One equities research analyst has rated the stock with a sell rating, two have issued a hold rating and two have assigned a buy rating to the stock. According to, the company has an average rating of “Hold”.

BE Semiconductor Industries Company Profile (Get Rating)

BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries worldwide. The company's principal products include die attach equipment, such as single chip, multi chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems; and packaging equipment, including conventional, ultra thin, and wafer level molding, as well as trim and form, and singulation systems.

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