ASE Technology (NYSE:ASX) Downgraded by StockNews.com to Hold

StockNews.com downgraded shares of ASE Technology (NYSE:ASXGet Rating) from a buy rating to a hold rating in a research report report published on Tuesday morning.

ASE Technology Trading Down 0.5 %

Shares of NYSE:ASX opened at $5.55 on Tuesday. ASE Technology has a 12-month low of $4.88 and a 12-month high of $8.65. The company has a market capitalization of $12.10 billion, a PE ratio of 4.66, a PEG ratio of 0.27 and a beta of 1.12. The business has a 50 day moving average of $5.77 and a two-hundred day moving average of $6.35. The company has a current ratio of 1.18, a quick ratio of 0.83 and a debt-to-equity ratio of 0.50.

Institutional Inflows and Outflows

Large investors have recently bought and sold shares of the stock. CWM LLC raised its stake in shares of ASE Technology by 116.8% during the 2nd quarter. CWM LLC now owns 5,007 shares of the semiconductor company’s stock worth $26,000 after buying an additional 2,697 shares during the period. EverSource Wealth Advisors LLC raised its stake in shares of ASE Technology by 299.4% during the 1st quarter. EverSource Wealth Advisors LLC now owns 4,992 shares of the semiconductor company’s stock worth $35,000 after buying an additional 3,742 shares during the period. Fieldpoint Private Securities LLC raised its stake in shares of ASE Technology by 137.7% during the 1st quarter. Fieldpoint Private Securities LLC now owns 6,239 shares of the semiconductor company’s stock worth $44,000 after buying an additional 3,614 shares during the period. Cambridge Investment Research Advisors Inc. acquired a new position in shares of ASE Technology during the 2nd quarter worth approximately $55,000. Finally, Alera Investment Advisors LLC acquired a new position in shares of ASE Technology during the 2nd quarter worth approximately $57,000. 6.57% of the stock is owned by institutional investors and hedge funds.

About ASE Technology

(Get Rating)

ASE Technology Holding Co, Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various packages; and copper and silver wire bonding solutions.

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