Tokyo Electron Limited to Post FY2024 Earnings of $4.25 Per Share, Jefferies Financial Group Forecasts (OTCMKTS:TOELY)

Tokyo Electron Limited (OTCMKTS:TOELY – Get Rating) – Equities researchers at Jefferies Financial Group lowered their FY2024 earnings per share (EPS) estimates for shares of Tokyo Electron in a research report issued on Tuesday, January 10th. Jefferies Financial Group analyst M. Nakanomyo now expects that the company will post earnings of $4.25 per share for the year, down from their prior forecast of $5.19. The consensus estimate for Tokyo Electron’s current full-year earnings is $4.83 per share. Jefferies Financial Group also issued estimates for Tokyo Electron’s FY2025 earnings at $4.97 EPS.

Separately, Berenberg Bank raised their price objective on shares of Tokyo Electron from 15,000.00 to 40,000.00 and gave the stock a “hold” rating in a research note on Friday, October 14th.

Tokyo Electron Stock Performance

TOELY stock opened at $87.03 on Friday. Tokyo Electron has a one year low of $58.33 and a one year high of $147.08. The company’s fifty day moving average price is $79.25 and its 200-day moving average price is $76.63. The company has a market capitalization of $54.23 billion, a PE ratio of 13.47 and a beta of 1.41.

Tokyo Electron (OTCMKTS:TOELY – Get Rating) last announced its quarterly earnings results on Thursday, November 10th. The company reported $2.08 earnings per share (EPS) for the quarter, topping analysts’ consensus estimates of $1.48 by $0.60. Tokyo Electron had a net margin of 22.30% and a return on equity of 37.99%. The company had revenue of $5.14 billion for the quarter, compared to analysts’ expectations of $4.77 billion.

Tokyo Electron Company Profile

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Tokyo Electron Limited, together with its subsidiaries, develops, manufactures, and sells semiconductor and flat panel display (FPD) production equipment in Japan, Europe, North America, Taiwan, China, South Korea, Southeast Asia, and internationally. The company offers coaters/developers, etch systems, surface preparation systems, deposition systems, test systems, wafer bonders/debonders, SiC epitaxial CVD systems, gas cluster ion beam system, and cleaning systems for use in the semiconductor manufacturing process.