BE Semiconductor Industries (OTCMKTS:BESIY) Upgraded to Equal Weight at Barclays

Barclays upgraded shares of BE Semiconductor Industries (OTCMKTS:BESIY) from an underweight rating to an equal weight rating in a research note published on Wednesday morning, FlyOnTheWall reports.

A number of other research firms have also recently weighed in on BESIY. Citigroup started coverage on shares of BE Semiconductor Industries in a research report on Thursday, June 29th. They set a neutral rating for the company. Deutsche Bank Aktiengesellschaft cut shares of BE Semiconductor Industries from a buy rating to a hold rating in a research report on Friday, June 23rd. Three equities research analysts have rated the stock with a hold rating and two have given a buy rating to the stock. Based on data from MarketBeat, the stock has a consensus rating of Hold and an average target price of $66.00.

BE Semiconductor Industries Stock Up 0.7 %

BESIY stock opened at $113.14 on Wednesday. The firm’s fifty day simple moving average is $112.90 and its 200-day simple moving average is $97.76. The company has a quick ratio of 5.87, a current ratio of 6.51 and a debt-to-equity ratio of 0.51. BE Semiconductor Industries has a 12 month low of $38.10 and a 12 month high of $120.68.

BE Semiconductor Industries (OTCMKTS:BESIY) last posted its earnings results on Thursday, July 27th. The technology company reported $0.72 earnings per share (EPS) for the quarter. BE Semiconductor Industries had a net margin of 30.61% and a return on equity of 29.16%. The firm had revenue of $176.90 million during the quarter.

BE Semiconductor Industries Company Profile

BE Semiconductor Industries N.V. engages in the development, manufacture, marketing, sale, and service of semiconductor assembly equipment for the semiconductor and electronics industries worldwide. The company's principal products include die attach equipment, such as single chip, multi-chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems; and packaging equipment, including conventional, ultra-thin, and wafer level molding, as well as trim and form, and singulation systems.