First County Bank CT acquired a new stake in shares of Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM – Free Report) during the 2nd quarter, according to the company in its most recent filing with the Securities and Exchange Commission (SEC). The institutional investor acquired 1,300 shares of the semiconductor company’s stock, valued at approximately $226,000.
Other institutional investors have also recently made changes to their positions in the company. Atlantic Edge Private Wealth Management LLC acquired a new position in shares of Taiwan Semiconductor Manufacturing during the second quarter valued at about $25,000. Valley Wealth Managers Inc. acquired a new position in shares of Taiwan Semiconductor Manufacturing during the second quarter valued at about $27,000. Olistico Wealth LLC acquired a new position in shares of Taiwan Semiconductor Manufacturing during the second quarter valued at about $27,000. NewSquare Capital LLC acquired a new position in shares of Taiwan Semiconductor Manufacturing during the second quarter valued at about $29,000. Finally, Fairscale Capital LLC acquired a new position in shares of Taiwan Semiconductor Manufacturing during the second quarter valued at about $32,000. Institutional investors and hedge funds own 16.51% of the company’s stock.
Taiwan Semiconductor Manufacturing Trading Down 4.7 %
Shares of TSM stock opened at $178.01 on Friday. Taiwan Semiconductor Manufacturing Company Limited has a 52-week low of $84.95 and a 52-week high of $193.47. The company has a debt-to-equity ratio of 0.26, a quick ratio of 2.21 and a current ratio of 2.47. The company has a 50-day simple moving average of $167.50 and a two-hundred day simple moving average of $159.18. The company has a market capitalization of $923.23 billion, a price-to-earnings ratio of 33.91, a PEG ratio of 1.07 and a beta of 1.14.
Taiwan Semiconductor Manufacturing Increases Dividend
The company also recently disclosed a quarterly dividend, which will be paid on Thursday, January 9th. Shareholders of record on Thursday, December 12th will be given a $0.4871 dividend. This represents a $1.95 dividend on an annualized basis and a yield of 1.09%. This is an increase from Taiwan Semiconductor Manufacturing’s previous quarterly dividend of $0.49. The ex-dividend date of this dividend is Thursday, December 12th. Taiwan Semiconductor Manufacturing’s dividend payout ratio is presently 37.71%.
Analyst Upgrades and Downgrades
Several brokerages have recently weighed in on TSM. Barclays upped their price objective on shares of Taiwan Semiconductor Manufacturing from $150.00 to $170.00 and gave the company an “overweight” rating in a report on Wednesday, June 5th. Needham & Company LLC upped their target price on shares of Taiwan Semiconductor Manufacturing from $168.00 to $210.00 and gave the stock a “buy” rating in a report on Monday, July 15th. Sanford C. Bernstein upped their target price on shares of Taiwan Semiconductor Manufacturing from $150.00 to $200.00 and gave the stock an “outperform” rating in a report on Thursday, June 20th. TD Cowen upped their target price on shares of Taiwan Semiconductor Manufacturing from $130.00 to $170.00 and gave the stock a “hold” rating in a report on Thursday, July 18th. Finally, Susquehanna restated a “positive” rating and issued a $250.00 target price on shares of Taiwan Semiconductor Manufacturing in a report on Wednesday, August 14th. One equities research analyst has rated the stock with a hold rating and five have assigned a buy rating to the company. According to MarketBeat, Taiwan Semiconductor Manufacturing has an average rating of “Moderate Buy” and a consensus price target of $200.00.
View Our Latest Stock Report on Taiwan Semiconductor Manufacturing
Taiwan Semiconductor Manufacturing Profile
Taiwan Semiconductor Manufacturing Company Limited, together with its subsidiaries, manufactures, packages, tests, and sells integrated circuits and other semiconductor devices in Taiwan, China, Europe, the Middle East, Africa, Japan, the United States, and internationally. It provides a range of wafer fabrication processes, including processes to manufacture complementary metal- oxide-semiconductor (CMOS) logic, mixed-signal, radio frequency, embedded memory, bipolar CMOS mixed-signal, and others.
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