ChipMOS TECHNOLOGIES INC. (NASDAQ:IMOS – Get Free Report) was the recipient of a significant decrease in short interest in the month of March. As of March 31st, there was short interest totalling 39,600 shares, a decrease of 9.0% from the March 15th total of 43,500 shares. Based on an average daily volume of 25,500 shares, the days-to-cover ratio is currently 1.6 days.
Analyst Upgrades and Downgrades
Separately, StockNews.com lowered shares of ChipMOS TECHNOLOGIES from a “strong-buy” rating to a “buy” rating in a research report on Thursday, April 11th.
Get Our Latest Report on ChipMOS TECHNOLOGIES
Institutional Investors Weigh In On ChipMOS TECHNOLOGIES
ChipMOS TECHNOLOGIES Stock Down 2.4 %
ChipMOS TECHNOLOGIES stock opened at $29.13 on Tuesday. The company has a debt-to-equity ratio of 0.54, a current ratio of 3.38 and a quick ratio of 3.04. ChipMOS TECHNOLOGIES has a fifty-two week low of $21.58 and a fifty-two week high of $32.19. The firm has a fifty day moving average price of $29.62 and a two-hundred day moving average price of $27.05. The firm has a market cap of $1.06 billion, a price-to-earnings ratio of 17.65 and a beta of 0.92.
ChipMOS TECHNOLOGIES (NASDAQ:IMOS – Get Free Report) last announced its earnings results on Thursday, February 22nd. The semiconductor company reported $0.43 earnings per share for the quarter, beating the consensus estimate of $0.42 by $0.01. The firm had revenue of $187.00 million during the quarter, compared to the consensus estimate of $175.31 million. ChipMOS TECHNOLOGIES had a return on equity of 7.62% and a net margin of 8.85%. The firm’s revenue for the quarter was up 22.2% compared to the same quarter last year. During the same quarter in the prior year, the company earned $0.22 EPS.
ChipMOS TECHNOLOGIES Company Profile
ChipMOS TECHNOLOGIES INC. researches, develops, manufactures, and sells high-integration and high-precision integrated circuits, and related assembly and testing services in the People's Republic of China, Japan, Singapore, and internationally. It operates through Testing; Assembly; Testing and Assembly for LCD, OLED and Other Display Panel Driver Semiconductors; Bumping; and Others segments.
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