BE Semiconductor Industries (OTCMKTS:BESIY) Share Price Crosses Above 200 Day Moving Average – Should You Sell?

Shares of BE Semiconductor Industries NV (OTCMKTS:BESIYGet Free Report) passed above its 200-day moving average during trading on Friday . The stock has a 200-day moving average of $158.33 and traded as high as $196.0180. BE Semiconductor Industries shares last traded at $196.0180, with a volume of 2,865 shares.

Wall Street Analyst Weigh In

Several research firms have weighed in on BESIY. Zacks Research raised BE Semiconductor Industries from a “strong sell” rating to a “hold” rating in a research report on Tuesday, October 14th. Deutsche Bank Aktiengesellschaft restated a “buy” rating on shares of BE Semiconductor Industries in a research note on Wednesday, October 15th. Needham & Company LLC raised BE Semiconductor Industries to a “buy” rating in a research note on Tuesday, January 6th. Sanford C. Bernstein reiterated an “outperform” rating on shares of BE Semiconductor Industries in a report on Sunday, January 4th. Finally, Morgan Stanley restated an “overweight” rating on shares of BE Semiconductor Industries in a report on Tuesday, January 13th. Five equities research analysts have rated the stock with a Buy rating and five have issued a Hold rating to the company. According to data from MarketBeat.com, the company presently has an average rating of “Moderate Buy”.

Read Our Latest Stock Report on BE Semiconductor Industries

BE Semiconductor Industries Trading Up 4.8%

The company has a debt-to-equity ratio of 1.46, a quick ratio of 5.02 and a current ratio of 5.75. The company’s 50-day moving average is $176.38 and its 200 day moving average is $158.33.

BE Semiconductor Industries Company Profile

(Get Free Report)

BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.

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