BE Semiconductor Industries (OTCMKTS:BESIY) Shares Gap Down – Should You Sell?

BE Semiconductor Industries NV (OTCMKTS:BESIYGet Free Report) gapped down before the market opened on Friday . The stock had previously closed at $220.00, but opened at $210.92. BE Semiconductor Industries shares last traded at $209.3950, with a volume of 1,427 shares trading hands.

Analyst Upgrades and Downgrades

Several analysts have commented on the stock. Citigroup restated a “neutral” rating on shares of BE Semiconductor Industries in a report on Tuesday, January 20th. Sanford C. Bernstein restated an “outperform” rating on shares of BE Semiconductor Industries in a research note on Sunday, January 4th. Morgan Stanley restated an “overweight” rating on shares of BE Semiconductor Industries in a research report on Tuesday, January 13th. Berenberg Bank upgraded BE Semiconductor Industries to a “hold” rating in a report on Monday, February 23rd. Finally, Needham & Company LLC upgraded shares of BE Semiconductor Industries to a “buy” rating in a report on Tuesday, January 6th. Five analysts have rated the stock with a Buy rating and six have given a Hold rating to the stock. According to data from MarketBeat, BE Semiconductor Industries has an average rating of “Hold”.

Check Out Our Latest Research Report on BE Semiconductor Industries

BE Semiconductor Industries Stock Down 2.4%

The company has a current ratio of 5.55, a quick ratio of 5.02 and a debt-to-equity ratio of 1.22. The firm has a market cap of $15.12 billion, a P/E ratio of 111.51 and a beta of 1.81. The company’s 50 day simple moving average is $207.09 and its 200-day simple moving average is $173.94.

About BE Semiconductor Industries

(Get Free Report)

BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.

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