BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report) shares dropped 11.6% during mid-day trading on Friday . The company traded as low as $250.0501 and last traded at $250.0501. Approximately 1,326 shares were traded during mid-day trading, a decline of 82% from the average daily volume of 7,524 shares. The stock had previously closed at $282.86.
Analyst Ratings Changes
A number of research firms have commented on BESIY. Deutsche Bank Aktiengesellschaft restated a “buy” rating on shares of BE Semiconductor Industries in a research report on Friday, May 15th. Morgan Stanley reiterated an “overweight” rating on shares of BE Semiconductor Industries in a research note on Tuesday, May 19th. Finally, Zacks Research cut BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a report on Friday, June 26th. Five analysts have rated the stock with a Buy rating and four have assigned a Hold rating to the stock. According to MarketBeat.com, BE Semiconductor Industries currently has an average rating of “Moderate Buy”.
Check Out Our Latest Stock Report on BE Semiconductor Industries
BE Semiconductor Industries Price Performance
BE Semiconductor Industries (OTCMKTS:BESIY – Get Free Report) last posted its quarterly earnings data on Thursday, April 23rd. The technology company reported $0.76 EPS for the quarter, meeting analysts’ consensus estimates of $0.76. BE Semiconductor Industries had a net margin of 24.02% and a return on equity of 38.42%. The company had revenue of $216.51 million during the quarter, compared to analyst estimates of $220.77 million. Equities analysts anticipate that BE Semiconductor Industries NV will post 4.45 EPS for the current year.
BE Semiconductor Industries Company Profile
BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.
Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.
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