BE Semiconductor Industries (OTCMKTS:BESIY) Trading Down 8% on Disappointing Earnings

BE Semiconductor Industries NV (OTCMKTS:BESIY)’s share price dropped 8% during mid-day trading on Thursday following a weaker than expected earnings announcement. The stock traded as low as $261.00 and last traded at $261.00. Approximately 1,664 shares were traded during trading, a decline of 79% from the average daily volume of 7,745 shares. The stock had previously closed at $283.80.

The technology company reported $1.29 EPS for the quarter, missing analysts’ consensus estimates of $1.30 by ($0.01). BE Semiconductor Industries had a return on equity of 38.42% and a net margin of 24.02%.

Analyst Upgrades and Downgrades

BESIY has been the subject of several research reports. Zacks Research lowered BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a research note on Friday, June 26th. Morgan Stanley restated an “overweight” rating on shares of BE Semiconductor Industries in a research report on Tuesday, May 19th. Finally, Deutsche Bank Aktiengesellschaft reaffirmed a “buy” rating on shares of BE Semiconductor Industries in a research note on Friday, May 15th. Five investment analysts have rated the stock with a Buy rating and four have given a Hold rating to the stock. According to MarketBeat, BE Semiconductor Industries presently has a consensus rating of “Moderate Buy”.

BE Semiconductor Industries Trading Down 8.1%

The stock has a market capitalization of $18.91 billion, a PE ratio of 117.98 and a beta of 1.97. The company’s 50 day moving average price is $315.30 and its two-hundred day moving average price is $257.89. The company has a debt-to-equity ratio of 1.11, a current ratio of 4.74 and a quick ratio of 4.17.

About BE Semiconductor Industries

BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.