BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report) was the recipient of a significant growth in short interest in the month of March. As of March 31st, there was short interest totaling 6,306 shares, a growth of 650.7% from the March 15th total of 840 shares. Based on an average trading volume of 17,090 shares, the short-interest ratio is presently 0.4 days. Approximately 0.0% of the shares of the stock are short sold.
BE Semiconductor Industries Trading Up 1.8%
Shares of BESIY opened at $248.90 on Friday. BE Semiconductor Industries has a 12-month low of $91.80 and a 12-month high of $250.60. The firm has a market capitalization of $18.05 billion, a PE ratio of 133.10 and a beta of 1.78. The company has a quick ratio of 4.88, a current ratio of 5.55 and a debt-to-equity ratio of 1.22. The stock’s fifty day simple moving average is $213.40 and its 200-day simple moving average is $182.78.
Analyst Upgrades and Downgrades
A number of analysts have weighed in on the company. Needham & Company LLC upgraded BE Semiconductor Industries to a “buy” rating in a report on Tuesday, January 6th. Morgan Stanley restated an “overweight” rating on shares of BE Semiconductor Industries in a report on Tuesday, January 13th. Berenberg Bank upgraded BE Semiconductor Industries to a “hold” rating in a report on Monday, February 23rd. Citigroup restated a “neutral” rating on shares of BE Semiconductor Industries in a report on Tuesday, January 20th. Finally, Sanford C. Bernstein restated an “outperform” rating on shares of BE Semiconductor Industries in a report on Sunday, January 4th. Five analysts have rated the stock with a Buy rating and six have issued a Hold rating to the company. According to data from MarketBeat.com, the company has an average rating of “Hold”.
BE Semiconductor Industries Company Profile
BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.
Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.
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