BE Semiconductor Industries (BESIY) Expected to Announce Earnings on Thursday

BE Semiconductor Industries (OTCMKTS:BESIY) is projected to post its resultson Thursday, April 23rd. Analysts expect BE Semiconductor Industries to post earnings of $0.76 per share and revenue of $220.77 million for the quarter.

BE Semiconductor Industries Trading Down 1.8%

BESIY opened at $256.99 on Thursday. BE Semiconductor Industries has a one year low of $103.71 and a one year high of $261.73. The company has a market cap of $18.63 billion, a P/E ratio of 137.43 and a beta of 1.78. The company has a debt-to-equity ratio of 1.22, a quick ratio of 4.88 and a current ratio of 5.55. The business’s 50-day simple moving average is $217.29 and its 200-day simple moving average is $185.27.

Analysts Set New Price Targets

A number of research analysts have recently commented on BESIY shares. Berenberg Bank upgraded BE Semiconductor Industries to a “hold” rating in a report on Monday, February 23rd. Sanford C. Bernstein reiterated an “outperform” rating on shares of BE Semiconductor Industries in a report on Sunday, January 4th. Needham & Company LLC upgraded BE Semiconductor Industries to a “buy” rating in a report on Tuesday, January 6th. Citigroup reiterated a “neutral” rating on shares of BE Semiconductor Industries in a report on Tuesday, January 20th. Finally, Kepler Capital Markets downgraded BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a report on Friday, January 9th. Five analysts have rated the stock with a Buy rating and six have issued a Hold rating to the company. According to MarketBeat, BE Semiconductor Industries presently has a consensus rating of “Hold”.

BE Semiconductor Industries Company Profile

BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.