BE Semiconductor Industries (OTCMKTS:BESIY) Shares Gap Down – Time to Sell?

BE Semiconductor Industries NV (OTCMKTS:BESIY) gapped down prior to trading on Friday . The stock had previously closed at $213.00, but opened at $203.00. BE Semiconductor Industries shares last traded at $200.52, with a volume of 1,632 shares changing hands.

Analyst Upgrades and Downgrades

Several analysts have recently issued reports on the company. Sanford C. Bernstein reissued an “outperform” rating on shares of BE Semiconductor Industries in a report on Sunday, January 4th. Kepler Capital Markets downgraded BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a research note on Friday, January 9th. Citigroup reaffirmed a “neutral” rating on shares of BE Semiconductor Industries in a research report on Tuesday, January 20th. Morgan Stanley reiterated an “overweight” rating on shares of BE Semiconductor Industries in a research note on Tuesday, January 13th. Finally, Needham & Company LLC upgraded shares of BE Semiconductor Industries to a “buy” rating in a research report on Tuesday, January 6th. Five equities research analysts have rated the stock with a Buy rating and six have assigned a Hold rating to the stock. According to MarketBeat, the stock has an average rating of “Hold”.

BE Semiconductor Industries Price Performance

The company has a debt-to-equity ratio of 1.22, a quick ratio of 4.88 and a current ratio of 5.55. The company has a market cap of $14.54 billion, a price-to-earnings ratio of 107.21 and a beta of 1.81. The business has a fifty day moving average price of $208.85 and a 200 day moving average price of $176.92.

About BE Semiconductor Industries

BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.